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Interfacial fracture strength property of micro-scale SiN/Cu components

Abstract

The strength against fracture nucleation from an interface free-edge of silicon-nitride (SiN)/copper (Cu) micro-components is evaluated. A special technique that combines a nano-indenter specimen holder and an environmental transmission electron microscope (E-TEM) is employed. The critical load at the onset of fracture nucleation from a wedge-shaped free-edge (opening angle: 90°) is measured both in a vacuum and in a hydrogen (H2) environment, and the critical stress distribution is evaluated by the finite element method (FEM). It is found that the fracture nucleation is dominated by the near-edge elastic singular stress field that extends about a few tens of nanometers from the edge. The fracture nucleation strength expressed in terms of the stress intensity factor (K) is found to be eminently reduced in a H2 environment.

Funding source: Microstructure Analysis Platform in ‘Nanotechnology Platform Project’ by the Ministry of Education, Culture, Sports, Science and Technology (MEXT); Japan Society for the Promotion of Science (JSPS)KAKENHI Nos. 25709003 (Grant-in -Aid for Young Scientists A), 25000012 (Specially Promoted Research).
Countries: Japan
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/content/journal1975
2016-07-21
2021-09-26
http://instance.metastore.ingenta.com/content/journal1975
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